Lĩnh vực ứng dụng Ngành công nghiệp màn hình và bán dẫn

Wafer‑Level Femtosecond‑Laser TGV Equipment

Đặc điểm máy

1. Flexible dimensional compatibility, supporting all‑specification wafers under 300 mm

2. Femtosecond‑laser‑enabled machining for high throughput and superior processing quality

3. Self‑developed process‑and‑control system

4. Integrated high‑precision automatic wafer alignment system

5. Fully‑automatic unattended operation

6. Numerous proprietary intellectual‑property rights and core technologies.


Lĩnh vực ứng dụng

Han's Laser self‑developed TGV (Through‑Glass Via) processing equipment delivers stable and reliable performance in mass production. It is widely used for machining multi‑size blind holes, profile‑shaped holes and conical holes, and possesses broad application potential in advanced packaging, display manufacturing, consumer‑electronics and life‑science industries.


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Technical Data Sheet

Machine Model

Wafer‑Level   Femtosecond‑Laser TGV Equipment

Max. Machining Size

12‑inch

Hole Positioning Accuracy

3μm

Operating Speed

≥800mm/s

Hole Roundness

(Outer‑hole & Inner‑hole)

≥95% (major‑axis / minor‑axis)

Hole‑wall Surface Roughness

≤100nm (subject to workpiece material   and etching performance)


Liên hệ
Liên hệ
Hotline
Hotline bán hàng
+86-400-666-4000
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