Lĩnh vực ứng dụng

Panel‑Level Femtosecond Laser TGV Etching Equipment for Reinforced Glass

Đặc điểm máy

1. Max. processing area: 730 mm × 920 mm, with flexible compatibility for various substrate sizes.

2. Femtosecond laser enables high‑throughput processing with superior quality.

3. Self-developed processing and control systems.

4. Integrated high‑precision automatic alignment and compensation system.

5. Fully automatic unattended operation.

6. Backed by multiple patents and proprietary core technologies.


Lĩnh vực ứng dụng

Mainly used for through‑glass via (TGV) etching of reinforced glass.


Ngành công nghiệp tấm nền OLED và LCD
Ngành công nghiệp bán dẫn
Technical Data Sheet

Machine Model

Panel‑Level   Femtosecond Laser TGV Etching Equipment for Reinforced Glass

Max. Processing Size

730x920mm

Hole Position Accuracy

5μm

Travel Speed

≥800mm/s

Hole Roundness (Outer‑hole & Inner‑hole)）

≥95% (Major‑axis / Minor‑axis)

Hole‑wall Surface Roughness

≤100nm (Subject to material and   etching capacity)


Sản phẩm đề xuất
Liên hệ
Liên hệ
Hotline
Hotline bán hàng
+86-400-666-4000
Top