Lĩnh vực ứng dụng

Laser Ring-Cutting and Cleaning Integrated Machine

Đặc điểm máy

1. The machine integrates multiple‑process functions: laser ring‑cutting, notch cutting, hole drilling, slot grooving, ID marking transfer and cleaning.

2. High‑precision recognition and positioning for wafer outline and notch.

3. 2D/3D vision inspection for cutting accuracy and cutting depth during machining.

4. FOUP feeding, high‑efficiency wafer handling by robotic handler.

5. Fully‑automatic operation for 12‑inch wafers.

6. Conforms to SEMI standards and supports SECS‑GEM communication.


Lĩnh vực ứng dụng

This machine delivers an integrated solution covering precision laser ring‑cutting, notch cutting, hole drilling, slot grooving, ID transfer and cleaning for the processing of moulded packages of semiconductor integrated circuits.


Ngành công nghiệp bán dẫn
Technical Data Sheet

Machine Model

Laser Ring‑Cutting and Cleaning Integrated Machine

Working Material

EMC

Wafer Size

12inch

Ring‑Cutting Width Specification

>150μm，adjustable

Ring‑Cutting Width Tolerance

±30μm

ID Transfer Depth

>5μm，adjustable

ID Transfer Width Tolerance

±10μm

Notch Cutting Accuracy

Size：±20μm，Angle：±3°

Molding Groove Plane‑Dimension   Accuracy

±10μm

Molding Groove Depth Accuracy

±20μm

Transmission System

Loadport、Robot、Aligner

Overall Dimensions (LxWxH)

3000mm*2240mm*2380mm


Sản phẩm đề xuất
Liên hệ
Liên hệ
Hotline
Hotline bán hàng
+86-400-666-4000
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