Lĩnh vực ứng dụng Ngành công nghiệp màn hình và bán dẫn

Fully-Automatic Laser Cutting Equipment

Đặc điểm máy

1. Self‑developed multi‑optical‑path system, compatible with the processing of multi‑material wafers

2. Automatic adhesive‑coating and cleaning system for precise control over adhesive consumption

3. Multi‑stage filtration system that effectively captures toxic dust and ensures operator safety

4. High‑quality hardware and software to ensure the consistency of parameter data

5. SEMI‑S2‑certified equipment, conforming to SEMI specifications


Lĩnh vực ứng dụng

It is mainly applied to the cutting process of VCSEL chips and bar‑shaped workpieces in the semiconductor industry, and supports laser cutting for gallium arsenide, indium phosphide and silicon wafers.


Ngành công nghiệp bán dẫn
Technical Data Sheet

Machine   Model

Fully-Automatic   Laser Cutting Equipment

Machinable   Materials

GaAs,  InP,  Si

Workpiece   Size

4inch,   6 inch, 8 inch

Workpiece   Thickness

50um-200um

Positioning   Accuracy

Straightness：±1μm，Repositioning Accuracy：±1μm

Laser   Wavelength

355nm,1064nm

(L × W   × H)

1140mm×1740mm×1750mm

 


Liên hệ
Liên hệ
Hotline
Hotline bán hàng
+86-400-666-4000
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